T-ZGM230S Z-Wave 800 SiP Module Data Sheet

T-ZGM230S Z-Wave 800 SiP Module Data Sheet

The ZGM230S is a system-in-package (SiP) module for Z-Wave connectivity and networking built for the performance, security, and energy demands of the Smart Home.

Based on the EFR32ZG23 SoC, it delivers robust RF performance, long-range, industry-leading security features, low-current consumption, a rich set of MCU peripherals, and ample memory, all in a 6.5 x 6.5 mm package.

The T-ZGM230S is a complete solution supported by powerful and fully-upgradeable software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your end-product, helping to accelerate its time-to-market significantly.

The ZGM230S is targeted for a broad range of applications, including:

  • Smart Home
  • Security
  • Lighting
  • Building Automation


Module Protocol Stack TX Power Freq Band Antenna Flash kB RAM kB Security GPIO Temp Range Carrier
T-ZGM230SA27HGN3 * Z-Wave * Z-Wave Long Range +14 dBm Sub-GHz RF pin 512 64 Vault-Mid 34 -40 to 85 C° Tray
T-ZGM230SB27HGN3 * Z-Wave * Z-Wave Long Range +14 dBm Sub-GHz RF pin 512 64 Vault-High 34 -40 to 85 C° Tray

Key Features

  • Z-Wave connectivity
  • RF pin for external antenna
  • +14 dBm TX power
  • -109.8 dBm RX sensitivity @100 kbps
  • 32-bit ARM Cortex-M33 core at 39 MHz
  • 512/64 kB of Flash/RAM memory
  • Advanced security features
  • Rich set of MCU peripherals
  • Integrated DC-DC converter
  • 34 GPIO pins
  • -40 to 85 °C
  • 6.5 mm x 6.5 mm

For additional information and to download the complete Data Sheet for the Z’Wave 800 SiP Module, please click here.