The ZGM230S is a system-in-package (SiP) module for Z-Wave connectivity and networking built for the performance, security, and energy demands of the Smart Home.
Based on the EFR32ZG23 SoC, it delivers robust RF performance, long-range, industry-leading security features, low-current consumption, a rich set of MCU peripherals, and ample memory, all in a 6.5 x 6.5 mm package.
The T-ZGM230S is a complete solution supported by powerful and fully-upgradeable software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your end-product, helping to accelerate its time-to-market significantly.
The ZGM230S is targeted for a broad range of applications, including:
- Smart Home
- Building Automation
|Module||Protocol Stack||TX Power||Freq Band||Antenna||Flash kB||RAM kB||Security||GPIO||Temp Range||Carrier|
|T-ZGM230SA27HGN3||* Z-Wave * Z-Wave Long Range||+14 dBm||Sub-GHz||RF pin||512||64||Vault-Mid||34||-40 to 85 C°||Tray|
|T-ZGM230SB27HGN3||* Z-Wave * Z-Wave Long Range||+14 dBm||Sub-GHz||RF pin||512||64||Vault-High||34||-40 to 85 C°||Tray|
- Z-Wave connectivity
- RF pin for external antenna
- +14 dBm TX power
- -109.8 dBm RX sensitivity @100 kbps
- 32-bit ARM Cortex-M33 core at 39 MHz
- 512/64 kB of Flash/RAM memory
- Advanced security features
- Rich set of MCU peripherals
- Integrated DC-DC converter
- 34 GPIO pins
- -40 to 85 °C
- 6.5 mm x 6.5 mm
For additional information and to download the complete Data Sheet for the Z’Wave 800 SiP Module, please click here.