T-ZGM230S Z-Wave 800 SiP Module Data Sheet
The ZGM230S is a system-in-package (SiP) module for Z-Wave connectivity and networking built for the performance, security, and energy demands of the Smart Home.
Based on the EFR32ZG23 SoC, it delivers robust RF performance, long-range, industry-leading security features, low-current consumption, a rich set of MCU peripherals, and ample memory, all in a 6.5 x 6.5 mm package.
The T-ZGM230S is a complete solution supported by powerful and fully-upgradeable software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your end-product, helping to accelerate its time-to-market significantly.
The ZGM230S is targeted for a broad range of applications, including:
- Smart Home
- Security
- Lighting
- Building Automation
Specifications
| Module | Protocol Stack | TX Power | Freq Band | Antenna | Flash kB | RAM kB | Security | GPIO | Temp Range | Carrier |
|---|---|---|---|---|---|---|---|---|---|---|
| T-ZGM230SA27HGN3 | * Z-Wave * Z-Wave Long Range | +14 dBm | Sub-GHz | RF pin | 512 | 64 | Vault-Mid | 34 | -40 to 85 C° | Tray |
| T-ZGM230SB27HGN3 | * Z-Wave * Z-Wave Long Range | +14 dBm | Sub-GHz | RF pin | 512 | 64 | Vault-High | 34 | -40 to 85 C° | Tray |
Key Features
- Z-Wave connectivity
- RF pin for external antenna
- +14 dBm TX power
- -109.8 dBm RX sensitivity @100 kbps
- 32-bit ARM Cortex-M33 core at 39 MHz
- 512/64 kB of Flash/RAM memory
- Advanced security features
- Rich set of MCU peripherals
- Integrated DC-DC converter
- 34 GPIO pins
- -40 to 85 °C
- 6.5 mm x 6.5 mm
For additional information and to download the complete Data Sheet for the Z’Wave 800 SiP Module, please click here.